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78015AP PDSP16 BU607D 03007 2SD200 8A431 8A431 2SC3354
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  multilayer ceramic chip capacitors 1 of 3 creation date : november 22, 2017 (gmt) CGA6P1X8R1E106K250AE tdk item description cga6p1x8r1e106kt***s applications automotive grade feature 150c high temperature application soft soft termination aec-q200 aec-q200 series cga6(3225) [eia 1210] status production size length(l) 3.20mm +0.50,-0.40mm width(w) 2.50mm 0.30mm thickness(t) 2.50mm 0.30mm terminal width(b) 0.20mm min. terminal spacing(g) recommended land pattern (pa) 2.00mm to 2.40mm recommended land pattern (pb) 1.00mm to 1.20mm recommended land pattern (pc) 1.90mm to 2.50mm electrical characteristics capacitance 10f 10% rated voltage 25vdc temperature characteristic x8r(15%) dissipation factor (max.) 5% insulation resistance (min.) 50m other soldering method re?ow aec-q200 yes packing blister (plastic)taping [180mm reel] package quantity 1000pcs ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 2 of 3 creation date : november 22, 2017 (gmt) CGA6P1X8R1E106K250AE characteristic graphs (this is reference data, and does not guarantee the products characteristics.) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.
multilayer ceramic chip capacitors 3 of 3 creation date : november 22, 2017 (gmt) CGA6P1X8R1E106K250AE associated images land pattern (terminal connection) ! images are for reference only and show exemplary products. ! this pdf document was created based on the data listed on the tdk corporation website. ! all speci?cations are subject to change without notice. copyright(c) tdk corporation. all rights reserved.


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